Rigid-Flex PCB
Rigid-Flex PCB Manufacturing
Smart Chiplink RIGID-FLEX PCB MGA KAKAYAHAN
Kapal ng Tapos na Produkto ( Flex Part, Walang Stiffener ):
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0.05-0.5mm ( Ultimate:0.5-0.8mm )
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Kapal ng Tapos na Produkto ( Matibay na Bahagi ):
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0.2-6.0mm
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Tapos na Kapal ng Tanso:
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0.5-5 OZ
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Min Tracing/Spacing:
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3mil / 3mil
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Surface Finish:
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HASL/OSP - RoHS ENIG / Hard Gold / Immersion Silver
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Impedance Control:
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310%
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Min Laser Hole:
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0.1mm
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Min Drilling Hole Diameter:
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8mil
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Iba Pang Mga Teknik:
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HDI Gold Fingers Stiffener ( 1 FR3 lang para sa PI / 5} {90} 82097}
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RIGID-FLEX PCB STACK-UP STRUCTURES AND DESIGN
Non-lamination flex&rigid board :
Lamination flex&rigid board :
Flex layer sa Inner layer :
Flex layer sa outlayer :
MGA MATERYAL NG RIGID-FLEX PCBS
Mga konduktor
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·Rolled annealed ( RA ) tanso
·Electro deposited ( ED ) tanso
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Mga Pandikit
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. Epoxy
·Acrylic
·Pre-preg
·Pressure Sensitive Adhesive ( PSA )
·Walang malagkit na batayang materyal
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Mga Insulator
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·FR-4
·Polyimide
·Polyester, Polyethylene Naphthalate ( PEN ), at Polyethylene ·Terephthalate {3}5} {6}Terephthalate {3}5} {6} 909101}
·Solder mask/Flexible solder mask
·Photo image-able cover lay ( PIC )
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Tapos
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·Solder ( Tin / Lead o RoHS compliant ) Tin
·Immersion Nickel / Gold / Silver
·Hard Nickel / ginto
·OSP
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matibay na flex pcb na proseso ng pagmamanupaktura